Advanced Semiconductor Process Technologies for ULSI Applications (SE35-95-0)

SynopsisSemiconductor processing technologies have advanced rapidly over the last decade, and such is not possible without the continuous improvement in the production tool, and cleanroom control. To attain ULSI and integrated circuits (ICs) with varied functionalities, performances and reliabilities; complex process know-how, advanced fabrication techniques, start-of-the-art technologies, devising of novel devices, and the continuous search for new materials are all inevitable. An in-depth understanding of these deep-submicron process technologies and ULSI devices are definitely crucial, not only for better understanding but also to serve as the essential background for the ever important technology invention and further development in the areas.

What previous participants say about this course
Answers to the question 'what did you like most about the course'

• "detail explanation, very good training material" - 19 Jun 06
• "instructor is good. She knows her stuff well" - 19 Jun 06
• "the presentation material is very good" - 19 Jun 06
• "Examples of other researchers experiences and sharing" - 9 Apr 07
• "Training material - excellent details" - 9 Apr 07
• "Clear presentation on the fabrication process and explaination on application from the theory with examples shown as well" - 9 Apr 07
• "Get to know more about the process, overview and latest development in semiconductor process - 26 Sep 08
• "Detailed description and good explanation with the data & picture shown. - 26 Sep 08

What You Will Learn

• The fundamental properties of silicon, semiconductor conduction, depletion, and leakage will be reviewed
• Each wafer fabrication processing area will be covered in detail
• How processing affects yield and parametric test
• Common problems associated with wafer fabrication and its impact on yield

Who Should AttendProcess, design, test, failure analysis, yield enhancement, packaging, and sales technicians, engineers, and managers working in the semiconductor or electronics industries.

PrerequisiteParticipants should have a basic background and understanding of semiconductor technologies and device physics. Previous familiarity will be advantageous in maximizing the impact of the course on the participant. Nonetheless, these concepts will be quickly reviewed as needed.

Course MethodologyThis course is presented in an interactive classroom style utilizing many practical examples.

Course Duration3 days, 9am - 5pm

Course StructureDay 1
Semiconductor Overview and Fundamentals
1) An Introduction to IC Fabrication: Yield, Cleanroom Basics, Structure of IC Fab, Testing and Packaging
2) Semiconductor Basics and Basic IC Process
3) Wafer Manufacturing: Epitaxial Growth and SOI Substrate
4) Overview of Process

Unit Processes and Technologies
5) Thermal Processes: Oxidation, diffusion, annealing, CVD and Rapid Thermal Processing (RTP).
6) Photolithography and lithography Trend

Day 2
Unit Processes and Technologies (Continued)
7) Plasma Basics
8) Ion Implantation
9) Wet and Dry Etching
10) Chemical Vapor Deposition (CVD) and Dielectric Thin Film
11) Metallization - Physical Vapor Deposition (PVD): Evaporation, Sputtering and Copper Plating
12) Chemical Mechanical Polishing (CMP)

Process Integration I: Device Isolation
13) Junction and Oxide Isolation
14) LOCOS Methods
15) Trench Isolation
16) Silicon-On-Insulator (SOI) Isolation Techniques
17) Semi-insulating Substrates

Day 3
Process Integration II: Contacts and Metallization
18) Schottky Contacts
19) Implanted Ohmic Contacts
20) Alloyed Contacts
21) Multilevel Metallization
22) Planarization and Advanced Interconnect

Process Integration III: Device Technologies
23) CMOS Technology
24) Bipolar Technology
25) BiCMOS Technology
26) MOS Memory Technology
27) Process Integration Considerations in ULSI Fabrication Technology
28) Summary and Future Trends