Mechanical Engineering - LEVEL I and LEVEL II (CP220)

Synopsis

The demand for engineers in communication-enabling technologies, who can contribute quickly upon graduation or entering the field, is increasing in tandem with the growth in communication industries and reduction in product time-to-market. Shortage of relevant skill sets are prevalent among young engineers due to the complexities of theories, lack of exposure to relevant industry tools and missing domain knowledge in various functions within the communication-enabling industries.

DreamCatcher Certification Program covers a comprehensive domain area in communication-enabling technologies, ranging from semiconductor materials and devices, circuit designs and tests, and, system integration, deployment, testing and commissioning. In collaboration with global technology partners and experts, DreamCatcher Certification Program is designed to help benchmark the expertise level of engineers working in these fields. It also provides an alternative development path for professionals to attain the relevant expertise to work in these challenging fields which see constant change of devices, systems, protocols and standards.

University typically emphasizes on the broad coverage of theories and concepts while on-the-job-training emphasizes on the ability to operate relevant industry tools. DreamCatcher Certification Program emphasizes on a balanced coverage of industry tools, domain knowledge and relevant theories and concepts for the development of specific domain expertise as illustrated below. This balanced approach will equip engineers with relevant skills to contribute more effectively when entering a specific technical field.



DreamCatcher Certification Program value propositions to young engineers and professionals are:

• To gain exposure to the state-of-the-art technologies, industry tools and software
• To gain expose to industry standard practices through case studies and projects
• To acquire knowledge and skills through a structured and extensive curriculum designed by industry experts and endorsed by global technology leaders
• To gain reassurance that his/her expertise meets industry-accepted standards, and that he/she has undertaken structured certification training program successfully, achieving the minimum benchmarked level. Therefore, certification serves as benchmark to expertise attained.

What You Will Learn

Upon successful completion of LEVEL I Certification, participants will be able

• To have a strong overview of the domain area with appreciation of underlying concepts, processes, tools and techniques employed specifically to the domain;
• To perform a prescribed range of functions involving known routines and procedures within the domain;
• To perform in a range of varied activities where there is a clearly defined choice of actions with limited complexity and limited range of applicable options to be applied, and;
• To have the relevant foundation to further acquire advanced skills within the domain.

Upon successful completion of LEVEL II Certification, participants will be able

• To have an in-depth understanding and appreciation of concepts, processes, tools and techniques employed specifically to the domain;
• To perform analysis involving complex routines and procedures within the domain;
• To perform technical decision-making activities involving a range of trade-off possibilities for technical task with limited complexity and limited range of applicable options to be applied; and
• To have the relevant in-depth understanding of the domain to further undertake experiential learning through solving technical challenges with higher complexities.

Who Should Attend

Fresh graduates or engineers interested to advance their technical career in the fields of communication-enabling technologies.

Prerequisite

For admission to LEVEL I Certification, candidates should have tertiary education level in relevant fields as follows:

• Mechanical Engineering,
• Mechatronics Engineering,

OR

3 years working experience in the relevant fields with other technical degree.


For admission to LEVEL II Certification, candidates should have tertiary education level in relevant fields as follows:

• Mechanical Engineering,
• Mechatronics Engineering,

AND

3 years working experience in the relevant fields and pass pre-entry assessment, OR completed LEVEL I Certification.

Course Methodology

The participants are first taught the relevant theories in a classroom setting. The concepts are re-enforced through tutorial and case studies of how the theories are applied in real-life. Demonstration using the state-of-the-art design and testing tools will be carried out to illustrate various principles and techniques.

The participants are then taught the use of software and hardware tools which are de-facto for the chosen domain area. The concepts are re-enforced through practical exercises on the use of the tools to test and design relevant applications.

Having acquired both practical skills in tools and pre-requisite knowledge in the domain area, the participants are required to apply their knowledge through individual or group project work. The participants will then present their project, demonstrating desired performance vs actual result.

Course Duration

LEVEL I Certification
15 days, 7 hours/day, with a total contact of 105 hours

LEVEL II Certification
15 days, 7 hours/day, with a total contact of 105 hours

Course Structure

Level I Certification

CAD Tools (ME01-01)
To provide participants with the basic understanding, hands-on drafting experience on simple features, parts assembly and simulation.
After completion of this course, participants should be able to (i) Model simple geometry (ii)Assemble parts (iii)Create drawings

Casting Material & Design (ME01-02)
Hot chamber and cold chamber, Casting material, Advantages and disadvantages of casting, Casting defects, Effective part design

Sheet Metal Material, Fabrication & Design (ME01-03)
The application of the sheet Metal, The Material Used in Sheet Metal, The Processes in Fabrication Sheet Metal into Product/Part, Mechanical Properties and Characteristics of sheet Metal, Fastening Assembly, Part Design of sheet Metal (Demo shown in OSDM)

Plastic Material & Design (ME01-04)
Introduction to plastic, Plastic material selection and its properties, Plastic Part Design Guidelines, Plastic Tooling introduction, Plastic Injection Molding introduction, Double shot design guidelines, Moulding Problem, Introduction to Moldflow analysis, Melt Flow Rate

PCB & Flex Material, Fabrication & Design (ME01-05)
PCB MATERIAL: General Information, Common Terminology, Basic PCB Material, Defining Layer Structure, FR4 and other material Information, High Performance Material

PCB FABRICATION PROCESS: Basic Concept of PCB Fabrication (High Level Flow), PCB Fabrication (Detail), Available Finishing, Common Manufacturing Problems, Common Board Level Problems, Soldermask

PCB TECHNOLOGY: High Density Interconnect, Unique Z-Axis Interconnection, Laser Drilling, Via Hole Plugging

Flex General Information and Material: General Information, Common Terms, Application, Material: Base Material, Material Construction, Stiffener, Pressure Sensitive Adhesive (PSA)

Flex Fabrication Process: CAM, Material Preparation, PTH Process, Circuit Formation, Coverfilm Lamination, Circuit Finishing, Outlining

Flex Technology: Market drivers for Flex technology, Adhesiveless material, Next generation of high performance flex circuits materials, Rigid Flex

Essentials of EMC for Mechanical Engineers (ME01-06)
1) INTRODUCTION
EMC Examples; EMC Definition; EMC Scenario; EMI Mitigation Methods; EMC Regulations, Standards; EMC Measurement Techniques

2) BASIC THEORIES
Electrical Noise Characteristics; Creation of Electromagnetic Disturbance; Creation of Electromagnetic Interference (EMI); Conducted Coupling mechanisms; Radiated Coupling mechanisms; Basic EMC Control and Design Techniques; Cabling & Connectors; Filters; Suppressors; Isolation; Need for RF Shielding; Importance of Grounding

3) SHIELDING
Shielding Mechanism; Shielding Effectiveness; Shielding Materials; Seams and Joints; Penetration - Pipes, Cables, Doors and others; Measurement of Shielding Performance

4) GROUNDING & BONDING
Earth and Safety Ground; Signal and Power Ground; Bonding Practice; Measurement of Bonding Resistance PRACTICAL DEMONSTRATION; Spectrum of a noise source; Measurement of conducted & radiated emissions; Transfer impedance of cables; Application of magnetic pickup loops and current probes; Use of ferrites for EMI control
EM shielding and grounding; ESD protective materials

Fundamentals of display technologies (ME01-07)
Theory of Operation of an LCD, LCD module components and functions of each component, Processes involve in LCD fabrication, LCD technology, Specific requirement and needs of LCD module design, Display Measurement System

Software Tools Used
Pro-E or One-Space Designer


Level II Certification

Stress Analysis (ME02-01)
Stress, Strain and their Relationship, Material Behaviour, Stresses and Strains in Axially loaded members, Stresses in Beams and their relevance, Combined Stresses and Theories of failure, Introduction to Component Design, Analysis and Design for Impact and Fatigue Loadings, Interfacial Stresses in Bimaterial and Trimaterial Systems, Introduction to Finite Element methods and applications in Axialal Bars, Beam bending and Two dimensional Stress Analysis and its relevance to Electronic Industries.
Design aspect of stress analysis. Hands-on activities using ProMechanica as CAE tool used.

Mechanical Vibration and Acoustic Noise - Analyses, Diagnostics and Attenuation (ME02-02)
Basic concepts of noise and vibration, Concepts and techniques for vibration suppression, Vibration measurement techniques and analysis, Computer softwares for vibration prediction and analysis, Noise measurement and attenuation methods, Practical cases studies to highlight and relate theories, analysis, techniques and real engineering systems

Statistics for Mechanical Design (ME02-03)
Tolerance analysis:
This course is aimed at introducing participants to the 6-sigma Tolerance Assignment Concepts and Methods.
After completion of this course, participants should be able to:
(i) Define the basis of 6-sigma tolerance assignments.
(ii) State the relationships between standard deviations and print tolerances.
(iii) Do correct tolerance assignments, which is the pre-requisite for the next level - tolerance stacks

or

GD&T for Mechanical Design (ME02-03)
Introduction to Geometric Dimensioning & Tolerancing (GD&T) Symbology based on the ASME Y14.5M-1994 standard:
Fundamental rules of dimensioning in Engineering drawings. General tolerancing principles and related principles. GD&T and conventional dimensioning comparison. GD&T modifiers and symbols. Basic dimensions, virtual condition, inner & outer boundary, worst-case boundary, and bonus tolerance. Form Controls: flatness, straightness, circularity, and cylindricity. Datums: planar datum system and datum targets. Orientation Controls: perpendicularity, angularity, parallelism. Profile Controls: profile of a line and profile of a surface. Runout Controls: circular runout and total runout. Location Controls: concentricity, symmetry and position. Tolerance of Position Controls: MMC, LMC, and RFS basic theories and applications

Design Project (DSD02-04)

Software Tools Used
Pro Mechanica / ANSYS, MiniTab