High-Speed Computing Board Design - LEVEL I and LEVEL II (CP213)

Synopsis

The demand for engineers in communication-enabling technologies, who can contribute quickly upon graduation or entering the field, is increasing in tandem with the growth in communication industries and reduction in product time-to-market. Shortage of relevant skill sets are prevalent among young engineers due to the complexities of theories, lack of exposure to relevant industry tools and missing domain knowledge in various functions within the communication-enabling industries.

DreamCatcher Certification Program covers a comprehensive domain area in communication-enabling technologies, ranging from semiconductor materials and devices, circuit designs and tests, and, system integration, deployment, testing and commissioning. In collaboration with global technology partners and experts, DreamCatcher Certification Program is designed to help benchmark the expertise level of engineers working in these fields. It also provides an alternative development path for professionals to attain the relevant expertise to work in these challenging fields which see constant change of devices, systems, protocols and standards.

University typically emphasizes on the broad coverage of theories and concepts while on-the-job-training emphasizes on the ability to operate relevant industry tools. DreamCatcher Certification Program emphasizes on a balanced coverage of industry tools, domain knowledge and relevant theories and concepts for the development of specific domain expertise as illustrated below. This balanced approach will equip engineers with relevant skills to contribute more effectively when entering a specific technical field.



DreamCatcher Certification Program value propositions to young engineers and professionals are:

• To gain exposure to the state-of-the-art technologies, industry tools and software
• To gain expose to industry standard practices through case studies and projects
• To acquire knowledge and skills through a structured and extensive curriculum designed by industry experts and endorsed by global technology leaders
• To gain reassurance that his/her expertise meets industry-accepted standards, and that he/she has undertaken structured certification training program successfully, achieving the minimum benchmarked level. Therefore, certification serves as benchmark to expertise attained.

What You Will Learn

Upon successful completion of LEVEL I Certification, participants will be able 

• To have a strong overview of the domain area with appreciation of underlying concepts, processes, tools and techniques employed specifically to the domain;
• To perform a prescribed range of functions involving known routines and procedures within the domain;
• To perform in a range of varied activities where there is a clearly defined choice of actions with limited complexity and limited range of applicable options to be applied, and;
• To have the relevant foundation to further acquire advanced skills within the domain.

Upon successful completion of LEVEL II Certification, participants will be able

• To have an in-depth understanding and appreciation of concepts, processes, tools and techniques employed specifically to the domain;
• To perform analysis involving complex routines and procedures within the domain;
• To perform technical decision-making activities involving a range of trade-off possibilities for technical task with limited complexity and limited range of applicable options to be applied; and
• To have the relevant in-depth understanding of the domain to further undertake experiential learning through solving technical challenges with higher complexities.

Who Should Attend

Fresh graduates or engineers interested to advance their technical career in the fields of communication-enabling technologies.

Prerequisite

For admission to LEVEL I Certification, candidates should have tertiary education level in relevant fields as follows: 

• Electrical and Electronic Engineering,
• Telecommunication Engineering,
• Microelectronics Engineering,
• Computer Engineering,
• Software Engineering,

OR

3 years working experience in the relevant fields with other technical degree.


For admission to LEVEL II Certification, candidates should have tertiary education level in relevant fields as follows:

• Electrical and Electronic Engineering,
• Telecommunication Engineering,
• Microelectronics Engineering,
• Computer Engineering,
• Software Engineering,

AND

3 years working experience in the relevant fields and pass pre-entry assessment, OR completed LEVEL I Certification.

Course Methodology

The participants are first taught the relevant theories in a classroom setting. The concepts are re-enforced through tutorial and case studies of how the theories are applied in real-life. Demonstration using the state-of-the-art design and testing tools will be carried out to illustrate various principles and techniques.

The participants are then taught the use of software and hardware tools which are de-facto for the chosen domain area. The concepts are re-enforced through practical exercises on the use of the tools to test and design relevant applications.

Having acquired both practical skills in tools and pre-requisite knowledge in the domain area, the participants are required to apply their knowledge through individual or group project work. The participants will then present their project, demonstrating desired performance vs actual result.

Course Duration

LEVEL I Certification
15 days, 7 hours/day, with a total contact of 105 hours

LEVEL II Certification
15 days, 7 hours/day, with a total contact of 105 hours

Course Structure

LEVEL 1 Certification

Introduction to Computer Architecture and Organization (HSC01-01)
Overview of computer fundamentals, storage and I/O systems, operating system, computer arithmetic, high performance computer systems

DRAM Technologies and Operations (HSC01-02)
Overview of computer's memory hierarchy, DRAM technologies, DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM and GDDR3 SDRAM device and operations

USB and Ethernet Interfacing for High-Speed Computing (HSC01-03)
Ethernet protocol, MAC layer and physical layer interface, TCP, DNS, HTTP, SMTP, TELNET, LAN, USB transactions, enumeration process, plug and play, USB 2.0, system development issues, debugging and development tools

PCI, PCI-X and PCI Express Technologies (HSC01-04)
Overview of PC system bus, PCI bus architecture, bus protocols, signal lines electrical characteristics, plug and play configuration, PCI bridging, PCI bios, featues of PCI-X, PCI express overview, PCI Express 2.0 updates.

Electronics Instrumentation (HSC01-05)
Introduction to electronics instrumentation, power supply, multimeter, function generator, and oscilloscope.

Essential of Analog Circuit Design (HSC01-06)
Basic circuit components and their characteristics, practical circuit analysis technique, frequency response of circuit, power, semiconductor components and characteristics, amplifier and op-amp circuit design, lab exercises

Schematic Drawing and PCB Layout Design (HSC01-07)
Overview of PCB and schematic capture CAD tools. Introduction to structures on PCB assembly (substrate material, copper layer, solder mask, vias, relief/thermals), components footprints (SMT & Thru-hole) and pad stacks. Concepts of schematic driven layout. Basic PCB layout design rules and strategies. Two small schematic capture and layout projects.

Software Tools Used
PCB Artist

Hardware Tools Used
Digital multimeter, DC power supply, function generator, frequency counter, digital oscilloscope


LEVEL 2 Certification

Introduction to High-Speed PCB Design (HSC02-01)
Fundamental concepts and signal integrity, PCB interconnect and packaging, transmission lines and signal propagation, simulation and design examples, review of computer modeling, simulation and CAD tools

Signal Integrity (SI) Measurement (HSC02-02)
Overview of signal distortion mechanisms on High Speed Digital I/O. SI Measurements. Eye diagrams, measuring power, jitter, duty cycle distortion, eyeline, etc. Complicance mask tests data communication measurement techniques. Serial channel performance optimization.

Controlling Conducted and Radiated EMI (HSC02-03)
Overview of EMC, EMI regulations, measurement setups, fundamental mechanism of conducted and radiated EMI, differential-mode and common-mode conduction and radiation, power line EMI filter design, case studies and experimental results.

Practical PCB Board Design Issues and Considerations (HSC02-04)
Industry terminology, board material, track and pad widths, etching, plating, soldermask, silkscreen, electrical test, routing, protection. Component placement, connectors, thermal relief, test points, multilayer boards, design rule check, gerber files, paneling. Tutorial: 4-layer compact microcontroller design.
Categorising signals, keep out regions, copper pours, manual routing, auto routing. Copper shielding, heat sinking, high current, intrinsic R/C/L, matching delays. Tutorial: Wireless sensor node design.
Analogue, digital, RF co-design, ECL design, USB, LVDS, DDR1/2/3 design. Tutorial: DDR3 design.

Individual Project (HSC02-05)
project selection, defintion, implementation

Software Tools Used
PCB Artist

Hardware Tools Used
Digital communication analyzer, power meter & sensor, spectrum analyzer